The Chinese technology company released the Ascend 960 SuperPoD and an upgraded UnifiedBus interconnect technology on Thursday to strengthen domestic computing capabilities. This rollout includes 11 new AI related semiconductors intended to reduce China's reliance on US hardware and compete with Nvidia, Intel, and AMD.

Rotating chairman David Wang announced the firm will launch two more artificial intelligence chips in 2027 to further scale its computing business. The expansion occurs in defiance of US export control curbs that restrict the shipment of high end semiconductor technology to Chinese entities.