Co-packaged optics using 200G per lane silicon photonics anchor a series of technology debuts by Marvell at the ECOC 2026 conference. The company is demonstrating industry first 2 nm optical interconnects, including a 102.4 Tbps platform designed to transition AI networks from 1.6 T toward 3.2 T connectivity. Additional demos feature 400G per lane optical PAM4, 800G ZR/ZR+ with integrated MACsec, and 1.6 T ZR coherent-lite O-band technologies.

The new platform integrates optics directly with AI accelerators and switch silicon to bypass the distance and power limits of traditional copper wiring. These components target hyperscalers connecting large clusters of GPUs, CPUs, and memory to increase bandwidth density while reducing power consumption per bit. The 2 nm process enables faster data movement between components as AI systems scale to millions of accelerators.