The Ascend 960DT semiconductor will debut in the first quarter of 2027, with the 960PR model following in the third quarter of that year. Huawei is currently testing these AI chips in select overseas markets and has developed 11 key chips using a Unified Bus interconnect to reduce dependence on US technology. The company has shipped more than 1,000 supernode systems to over 370 customers and claims its supercluster architecture can scale to 1 million NPUs.

Huawei holds a larger share of the Chinese AI chip market than Nvidia, according to Xu, though the company faces production constraints for its hardware. These chips are designed to bypass US export controls that limit China's access to advanced semiconductors. Rotating chairman David Wang announced the 2027 timeline as part of a strategy to challenge Nvidia's position in the global computing market.