Huawei will release the Ascend 960DT artificial intelligence semiconductor in the first quarter of 2027, followed by the 960PR model in the third quarter. The new chips, unveiled at the Huawei Connect 2026 conference in Shanghai, double overall performance and are part of a yearly iteration cycle including the Ascend 970 in 2028 and 980 in 2029. Rotating chairman Wang Tao stated that the 960DT launch is three quarters ahead of the original schedule.

The company's UnifiedBus architecture supports AI superclusters scaling to 1 million neural processing units, while its first mass-produced Hi-ONE optical interconnect delivers 7.2T transmission capacity per engine. Huawei has shipped more than 1,000 supernode systems to 370 customers to compete with Nvidia in China. The next-generation supernode reduces power draw by over 550 kW by replacing 48,000 optical modules with 5,500 proprietary optical engines.